Manufacturing Capabilities
- Single Sided PCB Division
| Item |
Capabilities |
| Number
of Layers |
Single,
double NPTH |
| Material |
CEM-1,
FR-2, FR-1, XPC-94HB |
| Board Thickness |
Min.
Thickness |
0.8mm
(32 mil) |
| Max.
Thickness |
1.6mm
(63 mil) |
| Surface
Finishing |
-Preflux |
| -Nickel
Plating |
| -Flash
Gold Plating |
| -Hot
Air Solder Leveling |
| -Entek
Coating (OSP) |
| -Hot
Air Solder Leveling - Lead Free |
| -Immersion
Tin |
| Solder
Mask |
LPI
(Wet Film), Thermal Cured Type, UV Type |
| Other
Printing |
Carbon
Print, Peelable Solder Mask |
| Solder
Mask Plugged Hole |
| Copper
Thickness |
1/2
oz (18 £gm) - 1 oz (35 £gm) |
| Min.
Hole Size |
CNC-Drilled
Type |
0.4mm
(16 mil) |
| Punched |
0.8mm
(32 mil) |
| Hole
Size Tolerance (CNC Drilled Type) |
+/-0.076mm
(3 mil) |
| Hole
Size Tolerance Punched) |
+/-0.1mm
(4 mil) |
| Min.
Line Width and Spacing |
0.2mm
(8 mil) |
| Min.
Solder Mask Clearance (UV Cure) |
0.15mm
(6mil) |
| Min.
Solder Mask Clearance (Thermal Cure) |
0.1mm
(4 mil) |
| PMin.
Annular Ring |
0.15mm
(6mil) |
| Profile
and V-Cut |
Stamping,
V-Cut and Beveling |
|
