Evergreen (HK) PCB Ltd. ability


Manufacturing Capabilities - Double Sided & Multi layers PCB Division

Item Capabilities
Number of Layers Double Sided - 12 Layers
Major Material FR-4, CEM-3, Hologen free, High Tg
(Other material as request)
Min. Board Thickness Double Side 0.2mm (7.8mil)
4 Layers 0.4mm (16 mil)
6 Layers 0.6mm (24 mil)
8 Layers 1.0mm (40 mil)
10 Layers 1.2mm (48 mil)
12 Layers 1.5mm (59 mil)
Max. Board Thickness 3.2mm (125 mil)
Surface Finishing -Flash Gold Plating
-Immersion Gold (Max. 0.5£gm)
-Thick Gold Plating (Max. 1.5£gm)
-HASL (Tin / Lead)

-Entek Coating (OSP) - Gold finger

-HASL - Lead Free
-Immersion Tin
Solder Mask LPI (Wet Film), Thermal Cured Type
Other Printing Carbon Print, Peelable Solder Mask
Solder Mask Plugged Hole
Copper Thickness (Finishing) 1/2 oz (18 £gm) - 4 oz (140 £gm)
Min. Hole Size 0.25mm (10 mil)
Hole Size Tolerance (NPTH) +/-0.05mm (2 mil)
Hole Size Tolerance (PTH) +/-0.076mm (3 mil)
Min. Line Width and Spacing 0.1mm (4 mil)
Min. Solder Mask Clearance 0.076mm (3mil)
Min. Annular Ring 0.076mm (3mil)
Profile and V-Cut V-Cut, Jump V-Cut, CNC V-Cut
CNC-Routing, Stamping and Beveling
Special Process Blind/Buried Via Hole