Manufacturing Capabilities - Double Sided & Multi
layers PCB Division
| Item |
Capabilities |
| Number
of Layers |
Double Sided - 12 Layers |
| Major
Material |
FR-4, CEM-3, Hologen free,
High Tg
(Other material as request) |
| Min.
Board Thickness |
Double
Side |
0.2mm (7.8mil) |
| 4
Layers |
0.4mm (16
mil) |
| 6
Layers |
0.6mm (24
mil) |
| 8
Layers |
1.0mm (40
mil) |
| 10
Layers |
1.2mm (48
mil) |
| 12
Layers |
1.5mm (59
mil) |
| Max.
Board Thickness |
3.2mm (125
mil) |
| Surface
Finishing |
-Flash Gold
Plating |
| -Immersion
Gold (Max. 0.5£gm) |
| -Thick Gold
Plating (Max. 1.5£gm) |
| -HASL (Tin
/ Lead) |
-Entek
Coating (OSP) - Gold finger |
| -HASL
- Lead Free |
| -Immersion
Tin |
| Solder
Mask |
LPI (Wet
Film), Thermal Cured Type |
| Other
Printing |
Carbon Print,
Peelable Solder Mask |
| Solder Mask
Plugged Hole |
| Copper
Thickness (Finishing) |
1/2 oz (18
£gm) - 4 oz (140 £gm) |
| Min.
Hole Size |
0.25mm (10
mil) |
| Hole
Size Tolerance (NPTH) |
+/-0.05mm
(2 mil) |
| Hole
Size Tolerance (PTH) |
+/-0.076mm
(3 mil) |
| Min.
Line Width and Spacing |
0.1mm (4
mil) |
| Min.
Solder Mask Clearance |
0.076mm
(3mil) |
| Min.
Annular Ring |
0.076mm
(3mil) |
| Profile
and V-Cut |
V-Cut, Jump
V-Cut, CNC V-Cut |
| CNC-Routing,
Stamping and Beveling |
| Special
Process |
Blind/Buried
Via Hole |
|
